How is the aluminum substrate PCB circuit board made?

How is the aluminum substrate PCB circuit board made?

How is the aluminum substrate PCB circuit board made?
Aluminum substrate PCB circuit board is the most cost-effective type of metal-based PCB board. The outstanding heat dissipation performance of this PCB board is better than copper-based PCB board and iron-based PCB board which are both metal substrates, which can prolong the service life of the product. Aluminum-based PCB circuit boards are widely used in the LED lighting equipment industry. In addition, they are also commonly used in a series of audio equipment such as audio amplifiers, power equipment such as switching regulators, and automotive equipment such as igniters.

Classified by surface technology, it is generally divided into tin-sprayed aluminum-based PCB boards, anti-oxidation aluminum-based PCB boards, silver-plated aluminum-based PCB boards, and immersion gold aluminum-based PCB boards.

Common thicknesses of aluminum-based PCB boards are usually 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.5mm and 3.0mm. Copper foil thickness is usually 18um, 35um, 70um, 105um and 140um.

The thermal insulating layer is one of the most important core technologies of the aluminum substrate, and it is basically composed of a special polymer filled with a special porcelain.

The basic production process of aluminum-based PCB can be divided into the following points:

1. Cutting: Cut the entire large-size aluminum substrate raw material according to the required production size, and avoid scratching the sheet during the cutting process.

2. Drilling: By mechanical drilling, the aluminum substrate is drilled with positioning holes, test holes and component holes.

3. Circuit: According to the requirements of the data, make the required circuit on the board.

4. Pressing and filling: This process is very important. If it is not done properly, it may cause short circuits and open circuits on the board, and there may also be insufficient glue filling or bubbles. The method of filling holes on one side can avoid the above situation as much as possible.

5. Etching: After the circuit is completed, etch off the excess part and keep the required part.

6. Solder mask and silk screen: Complete solder mask and character printing according to the data requirements; solder mask is to protect the circuit and prevent oxidation, and text silk screen is convenient for subsequent electronic components to be plugged in and repaired badly.

7. Surface treatment: Copper is very easy to oxidize in the bare environment, which may lead to poor tinning, and the surface treatment is to protect the copper surface.

8. Shape stamping: punch out the shape according to the shape requirements in the data.

9. Electrical performance test: test whether the circuit is open or short circuit, and whether it can work normally.

Final inspection: Detect the shape, hole copper, solder mask characters and other items. After the final inspection is up to standard, it can be packaged and shipped.
Post your feedback

The Code: